1 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com smd ? b EAST16082YA0 features ? package in 8mm tape on 7 diameter reel. ? compatible with automatic placement equipment. ? compatible with infrared and vapo r phase reflow solder process. ? multi-color type. ? pb-free. ? esd protection. ? the product itself will remain wi thin rohs compliant version. ? compliance with eu reach. ? compliance halogen free .(br <900 pp m ,cl <900 ppm , br+cl < 1500 ppm). description ? the smd led is much smaller than lead frame type components, thus enable smaller board size, higher p acking density, reduced storage space and fi nally smaller equipment to be obtained. ? besides, lightweight makes them ideal for miniature applications. etc. a pplications ? backlighting in dashboard and switch. ? telecommunication: indicator and b acklighting in telephone and fax. ? flat backlight for lcd, switch and symbol. ? general use.
datasheet smd ? b EAST16082YA0 2 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com device selection guide chip materials emitted color resin color algainp brilliant yellow water clear a bsolute maximum ratings (ta=25 ) parameter symbol rating unit reverse voltage v r 5 v forward current i f 25 ma peak forward current (duty 1/10 @1khz) i fp 60 ma power dissipation pd 60 mw operating temperature t opr -40 ~ +85 storage temperature tstg -40 ~ +90 electrostatic discharge esd hbm 2000 v soldering temperature t sol reflow soldering : 260 for 10 sec. hand soldering : 350 for 3 sec. electro-optical ch aracteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity iv 18 ----- 45 mcd i f =5ma viewing angle 2 1/2 ----- 120 ----- deg peak wavelength p ----- 591 ----- nm dominant wavelength d 585.5 ----- 594.5 nm spectrum radiation bandwidth ? ----- 15 ----- nm forward voltage v f 1.7 ---- 2.2 v reverse current i r ----- ----- 10 a v r =5v notes: 1.tolerance of luminous intensity 11% 2.tolerance of dominant wavelength 1nm 3.tolerance of forward voltage 0.05v
datasheet smd ? b EAST16082YA0 3 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com bin range of luminous intensity bin code min. max. unit condition m1 18.0 22.5 mcd i f =5ma m2 22.5 28.5 n1 28.2 36.0 n2 36.0 45.0 bin range of dom. wavelength group bin code min. max. unit condition a d3 585.5 585.5 nm i f =5ma d4 588.5 588.5 d5 591.5 591.5 bin range of luminous voltage group bin code min. max. unit condition v 19 1.7 1.8 v i f =5ma 20 1.8 1.9 21 1.9 2.0 22 2.0 2.1 23 2.1 2.2 notes: 1.tolerance of luminous intensity 11% 2.tolerance of dominant wavelength 1nm 3.tolerance of forward voltage 0.05v
datasheet smd ? b EAST16082YA0 4 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com typical electro-optical characteristics curves ( ) % relative luminous intensity f i (ma) ambient temperature luminous intensity vs. forward current ( ) % i (ma) f forward current forward current derating curve relative luminous intensity forward current vs. forward voltage ta=25c f forward voltage v (v) forward current luminous intensity vs. ta=25c forward current i (ma) f radiation diagram ta=25c ambient temperature ta (c) ambient temperature ta (c) ta=25c wavelength (nm) relative luminous intensity ( % spectrum distribution
datasheet smd ? b EAST16082YA0 5 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com package dimension 1.6 0.8 recommend soldering pad polarity cathode pad 0.20.05 0.35 0.36 0.65 0.69 0.77 suggested pad dime nsion is just fo r reference only. please modify the pa d dimension based on individual need. top side bottom 0.80.2 0.550.2 0.770.2 1.320.2 0.8 1.6 note: tolerances unless mentioned 0.1mm. unit = mm
datasheet smd ? b EAST16082YA0 6 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com moisture resistant packing materials label explanation ? cpn: customer?s product number ? p/n: product number ? qty: packing quantity ? cat: luminous intensity rank ? hue: chromaticity coordinates ? ref: forward voltage rank ? lot no: lot number reel dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm
datasheet smd ? b EAST16082YA0 7 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com carrier tape dimensions: loade d quantity 3000 pcs per reel polarity note: the tolerances unless mentioned is 0.1mm ,unit = mm moisture resistant packaging label desiccant label aluminum moisture-proof bag
datasheet smd ? b EAST16082YA0 8 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com precautions for use 1. over-current-proof customer must apply resistors for protection, ot herwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package: the leds should be kept at 30 or less and 90%rh or less. 2.3 after opening the package: the led's floor life is 1 year under 30 or less and 60% rh or less. if unused leds remain, it should be stored in moisture proof packages. 2.4 if the moisture absorbent material (silica gel ) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile pre-heating 150~200c 60~120sec. above 217c 60~150sec. 260c max. 10sec. max. 6c/sec.max. above255c 30sec.max. 3c/sec.max. 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. 4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two second s and more intervals, and do soldering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds hav e been soldered. when repairing is unavoidable, a double-head soldering iron should be used (as below figure). it should be confirmed beforehand whether t he characteristics of the leds will or will not be damaged by repairing.
datasheet smd ? b EAST16082YA0 9 copyright ? 2010, everlight americas inc. all rights reserved. release date : 28-sep-2012. issue no: 1 rev.1 www.everlightamericas.com application restrictions high reliability applications such as military/aer ospace, automotive safety/security systems, and medical equipment may require different product. if you have any concerns, please contac t everlight americas before using this product in your application. th is specification guarantees the quality and performance of the product as an individual component. do not use this product beyond the specification described in this document.
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